Splet03. jun. 2024 · 寸法 70x47x0.25mm の Honeywell* サーマル・インターフェイス・マテリアル PCM45F (サプライヤー部品番号 099079) は、LGA3647 ソケットをサポートするインテル® Xeon®・スケーラブル・プロセッサーで使用することをお勧めします。. この情報は、同じソケットを ... SpletFebruary 2008 002 Updated the TDPMax config value to 25.7 W in Table 3 November 2007 001 Initial release Revision Number Descriptions Revision Associated Life Cycle Milestone Release Information 0.0 POP L3 Closure Initial Documentation - Typically Internal Only 0.1–0.4 When Needed Project Dependent - Typically Internal Only
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Splet0 5 10 15 20 25 30 35 40 45 0.07 0.06 0.05 0.04 0.03 0.02 0.01 0.00 Pressure (psi) TI (˚C.cm 2 /W) Honeywell TIMs Serve Multiple Applications Consumer Electronics Telecomm … chen\u0027s wok whitestown menu
PCM45F High volume resistivity thermally conductive Phase
SpletPCM45F-SP is Honeywell's thermally conductive phase change paste, which is available in Stencil printable form. It is designed to minimize thermal resistance at interfaces and maintain extremely stable performance through reliability testing required for long product life applications. SpletHoneywell* PCM45F material is selected for use with the Intel reference heatsink design. The recommended size ensures adequate coverage at the interface between the processor IHS and heatsink pedestal. ... Retention Assembly Mechanical Drawings Figure E-25. Bolster Plate, M3 Captive Nut ® ® Order Number: 334785-002 Intel Xeon Phi™ Processor ... SpletText: . Intel provides both End of Line and End of Life TIM thermal resistance values of Honeywell PCM45F. End , . 16 Honeywell PCM45 F* TIM Performance as a Function of Attach Pressure . , Honeywell PCM45 F, 0.25 mm (0.010 in.) thick, 25 mm x … flights from chennai to philadelphia